AS4C8M16S-6BIN

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics:
  • High-speed operation
  • Low power consumption
  • Compact package size
• Package: BGA (Ball Grid Array)
• Essence: Dynamic Random Access Memory (DRAM)
• Packaging/Quantity: Individually packaged, quantity varies based on customer requirements

Specifications

• Part Number: AS4C8M16S-6BIN
• Organization: 8 Meg x 16
• Speed: 6ns
• Voltage: 3.3V
• Interface: Parallel
• Operating Temperature: -40°C to +85°C
• Refresh: Auto-refresh and self-refresh modes supported
• RoHS Compliance: Yes

Detailed Pin Configuration

The AS4C8M16S-6BIN has a total of 54 pins arranged in a specific configuration. The pinout is as follows:

1. VDD
2. DQ0
3. DQ1
4. DQ2
5. DQ3
6. DQ4
7. DQ5
8. DQ6
9. DQ7
10. VSS
11. DQ8
12. DQ9
13. DQ10
14. DQ11
15. DQ12
16. DQ13
17. DQ14
18. DQ15
19. VSS
20. A0
21. A1
22. A2
23. A3
24. A4
25. A5
26. A6
27. A7
28. VSS
29. A8
30. A9
31. A10
32. A11
33. A12
34. A13
35. A14
36. A15
37. VSS
38. /CAS
39. /RAS
40. /WE
41. /CS0
42. /CS1
43. /CS2
44. /CS3
45. VSS
46. /OE
47. /LB
48. /UB
49. /CE
50. VCCQ
51. VREF
52. VSS
53. VCC
54. NC

Functional Features

• High-speed operation allows for quick data access and transfer.
• Low power consumption ensures efficient use of energy.
• Compact package size enables space-saving designs.
• Auto-refresh and self-refresh modes help maintain data integrity.
• RoHS compliance ensures environmental friendliness.

Advantages and Disadvantages

Advantages: - High-speed operation improves system performance. - Low power consumption prolongs battery life in portable devices. - Compact package size facilitates miniaturization of electronic devices. - Auto-refresh and self-refresh modes enhance data reliability.

Disadvantages: - Limited storage capacity compared to other memory technologies. - Relatively higher cost per unit compared to some alternative memory modules.

Working Principles

The AS4C8M16S-6BIN is a dynamic random access memory (DRAM) module. It stores data in capacitors within its memory cells, which need to be periodically refreshed to maintain the stored information. The module communicates with the host system through a parallel interface, allowing for fast data transfer.

Detailed Application Field Plans

The AS4C8M16S-6BIN memory module finds applications in various fields, including: 1. Personal computers 2. Laptops and notebooks 3. Servers and data centers 4. Networking equipment 5. Consumer electronics 6. Industrial automation 7. Automotive electronics 8. Medical devices

Detailed and Complete Alternative Models

1. AS4C8M16S-6BCN: Similar specifications, different package (TSOP)
2. AS4C8M16S-6TCN: Similar specifications, different package (TSOP)
3. AS4C8M16S-6TIN: Similar specifications, different package (TSOP)
4. AS4C8M16S-6TBN: Similar specifications, different package (TSOP)
5. AS4C8M16S-6BINX: Similar specifications, extended temperature range

These alternative models offer similar functionality and performance but may differ in package type or operating temperature range.

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